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1 ? fn6526.1 isl55016 mmic silicon bipolar di fferential amplifier the isl55016 is a high performance gain block which can match a 75 single-ended source to a 100 differential load. this feature makes the isl55016 ideal for a wide range of general-purpose applications such as satellite tv. the isl55016 can be used as single-ended to differential converter and eliminates the need for an external balun structure. pinout isl55016 (6 ld tdfn) top view pin descriptions features ? input impedance of 75 single-ended ? output impedance of 100 differential ? noise figure of 5.4db ? oip3 of 26dbm ? input return loss of 27db ? pb-free (rohs compliant) applications ? active balun function ? lnb and lnb-t (hdtv) amplifiers ? if gain blocks for satellite and terrestrial stbs ? pa driver amplifier ? wireless data, satellite ? bluetooth/wifi ? satellite locator and signal strength meters typical application circuit ordering information part number (note) part marking temp. range (c) package (pb-free) pkg. dwg. # ISL55016IRTZ-T7* m9 -40 to +85 6 ld tdfn l6.1.6x1.6b *please refer to tb347 for detai ls on reel specifications. note: these intersil pb-free pl astic packaged products employ special pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is rohs compliant and compatible with both snpb and pb-free soldering operations). intersil pb-f ree products are msl classified at pb-free peak reflow temperatures that meet or exceed the pb-free requirements of ipc/jedec j std-020. pin number pin name description 1 vsm ground 2 vinm single-ended input. vinm should be ac-coupled. 3 vinp ac ground 4, 5 vop, vom differential outputs. vop and vom should be ac-coupled. differential impedance 100 . 6 vsp power supply. +5v 1 2 3 6 4 5 vsm vinm vinp vsp vom vop gnd 100nh 100pf 0.1f 100pf 100pf 1 6 5 4 100pf 100nh +5v 27 2 3 100pf 27 data sheet june 24, 2008 caution: these devices are sensitive to electrosta tic discharge; follow proper ic handling procedures. 1-888-intersil or 1-888-468-3774 | intersil (and design) is a registered trademark of intersil americas inc. copyright ? intersil americas inc. 2008. all rights reserved. all other trademarks mentioned are the property of their respective owners.
2 fn6526.1 june 24, 2008 absolute m aximum ratings (t a = +25c) thermal information supply voltage from vsp to gnd . . . . . . . . . . . . . . . . . . . . . . 5.75v input voltage . . . . . . . . . . . . . . . . . . . . . . . v s + +0.3v to gnd -0.3v esd rating human body model (per mil-std-883 method 3015.7) . . . . .3kv machine model (per eiaj ed-4701 method c-111) . . . . . . . .300v thermal resistance (typical, note 1) ja (c/w) 6 ld tdfn package. . . . . . . . . . . . . . . . . . . . . . . . . 125 storage temperature . . . . . . . . . . . . . . . . . . . . . . . .-65c to +125c operating junction temperature . . . . . . . . . . . . . . . . . . . . . . +135c pb-free reflow profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/pb-freereflow.asp caution: do not operate at or near the maximum ratings listed fo r extended periods of time. exposure to such conditions may adv ersely impact product reliability and result in failures not covered by warranty. 1. ja is measured in free air with the component mounted on a high ef fective thermal conductivity te st board with ?direct attach? fe atures. see tech brief tb379. electrical specifications vsp = +5v, z rsc = 50 single-ended connected to vinm, z load = 100 differential across vom and vop, vinp ac-grounded, t a = +25c, unless otherwise specified. parameter description conditions min typ max unit vsp supply voltage 4.5 5.0 5.5 v i_vsp operating current 91 104 117 ma sds21_diff small signal gain, differential 50mhz z rsc = 75 , z load = 100 17.5 db 1.0ghz z rsc = 75 , z load = 100 17.1 db 2.0ghz z rsc = 75 , z load = 100 15.5 db ssd12_diff reverse isolation, differential 50mhz z rsc = 75 , z load = 100 28.4 db 1.0ghz z rsc = 75 , z load = 100 30.2 db 2.0ghz z rsc = 75 , z load = 100 36.3 db sss11_se input return loss, single-ended 50mhz z rsc = 75 , z load = 100 27.1 db 1.0ghz z rsc = 75 , z load = 100 15.1 db 2.0ghz z rsc = 75 , z load = 100 6.9 db sdd22_diff output return loss, differential 50mhz z rsc = 75 , z load = 100 17.4 db 1.0ghz z rsc = 75 , z load = 100 10.6 db 2.0ghz z rsc = 75 , z load = 100 5.6 db s21_se gain of pin vop, single-ended 50mhz 13.2 14.5 15.7 db 1.0ghz 12.9 14.0 15.4 db 2.0ghz 12.0 12.9 14.5 db s31_se gain of pin vom, single-ended 50mhz 12.9 14.1 15.4 db 1.0ghz 12.4 13.5 14.9 db 2.0ghz 11.3 12.1 13.8 db p1db_diff output power at 1db compression point, differential 50mhz, (note 2) 15 17.2 19 dbm 1.0ghz, (note 2) 13.9 15.8 17.9 dbm 2.0ghz, (note 2) 10.4 12.0 14.4 dbm oip3_4_se output third order intercept point at vop pin, single-ended f1 = 50mhz, f2 = 55mhz 22.7 27.5 32.7 dbm f1 = 1.0ghz, f2 = 1.1ghz 22.1 24.2 29.1 dbm f1 = 2.0ghz, f2 = 2.1ghz 16.2 18.1 22.2 dbm oip3_5_se output third order intercept point at vom pin, single-ended f1 = 50mhz, f2 = 55mhz 22.6 26.6 32.6 dbm f1 = 1.0ghz, f2 = 1.1ghz 21.9 23.6 27.9 dbm f1 = 2.0ghz, f2 = 2.1ghz 14.9 17.3 21.4 dbm isl55016
3 fn6526.1 june 24, 2008 oip3_diff output third order intercept point, differential f1 = 50mhz, f2 = 55mhz 29.1 dbm f1 = 1.0ghz, f2 = 1.1ghz 26.2 dbm f1 = 2.0ghz, f2 = 2.1ghz 20.2 dbm oip2_diff output second order intercept point, differential f1 = 50mhz, f2 = 55mhz, im2 @105mhz 54.5 dbm f1 = 1.0ghz, f2 = 1.1ghz, im2 @ 2.1ghz 58.6 dbm f1 = 2.0ghz, f2 = 2.1ghz, im2 @ 4.1ghz 61.7 dbm bw_diff 3db bandwidth, differential 3db below gain @ 50mhz 2.2 ghz nf_diff noise figure, differential 1.0ghz 5.4 db freq frequency range 0.05 3 ghz note: 2. the numbers are derived from the single-ended results. electrical specifications vsp = +5v, z rsc = 50 single-ended connected to vinm, z load = 100 differential across vom and vop, vinp ac-grounded, t a = +25c, unless otherwise specified. (continued) parameter description conditions min typ max unit isl55016
4 fn6526.1 june 24, 2008 typical performance (i) z rsc = 75 , z load = 100 differential , z load = 25 . common figure 1. |sds21| vs frequency figure 2. |scs21| vs frequency figure 3. |s11| vs frequency figure 4. |sdd22| vs input power figure 5. |ssd12| and |ssc12| vs frequency figure 6. smith chart of s11 and sdd22 10 11 12 13 14 15 16 17 18 0 0.5g1.0g1.5g2.0g2.5g3.0g frequency (hz) db -16 -14 -12 -10 -8 -6 -4 -2 0 0 0.5g 1.0g 1.5g 2.0g 2.5g 3.0g frequency (hz) db -30 -25 -20 -15 -10 -5 0 0 0.5g1.0g1.5g2.0g2.5g3.0g frequency (hz) db -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 0 0.5g1.0g1.5g2.0g2.5g3.0g frequency (hz) db -45 -40 -35 -30 -25 -20 0 0.5g 1.0g 1.5g 2.5g 3.0g db ssc12 ssd12 2.0g frequency (hz) sdd22 s11 isl55016
5 fn6526.1 june 24, 2008 typical performance (ii) 50 environment, z rsc = 50 , z load port 2 = 50 , z load port 3 = 50 ; measured on probe station. figure 7. |s21| vs frequency figure 8. |s31| vs frequency figure 9. |s11| vs frequency figure 10. smith chart of s11 figure 11. |s22| vs frequency figure 12. smith chart of s22 10 11 12 13 14 15 0 0.5g 1.0g 1.5g 2.5g 3.0g frequency (hz) db 2.0g 10 11 12 13 14 15 0 0.5g 1.0g 1.5g 2.0g 2.5g 3.0g frequency (hz) db -14 -12 -10 -8 -6 -4 -2 0 0 0.5g1.0g1.5g2.0g2.5g3.0g frequency (hz) db -18 -16 -14 -12 -10 -8 -6 -4 -2 0 0 0.5g1.0g1.5g2.0g2.5g3.0g frequency (hz) db isl55016
6 fn6526.1 june 24, 2008 typical performance (iii) 50 environment, z rsc = 50 , z load port 2 = 50 , z load port 3 = 50 , measured on probe station figure 13. |s33| vs frequency figure 14. smith chart of s33 figure 15. 1db compression point vs frequency figure 16. im3 of pin 4 vs input power figure 17. im3 of pin 5 vs input power figure 18. oip3 vs frequency -12 -10 -8 -6 -4 -2 0 0 0.5g 1.0g 1.5g 2.0g 2.5g 3.0g frequency (hz) db 0 2 4 6 8 10 12 14 16 0 500m 1g 1.5g 2.0g frequency (hz) dbm pin 5 pin 4 -60 -50 -40 -30 -20 -10 0 10 -16 -15 -14 -13 -12 -11 -10 -9 -8 input power (dbm) dbm fundamental (1ghz and 1.1ghz) im3 (900mhz) im3 (1.2ghz) -60 -50 -40 -30 -20 -10 0 10 -16 -15 -14 -13 -12 -11 -10 -9 -8 input power (dbm) dbm fundamental (1ghz and 1.1ghz) im3 (900mhz) im3 (1.2ghz) 0 5 10 15 20 25 30 0 500m 1g 1.5g 2.0g frequency (hz) dbm pin 5 pin 4 isl55016
7 fn6526.1 june 24, 2008 typical performance (iv) 50 environment, z rsc = 50 , z load port 2 = 50 , z load port 3 = 50 , measured on probe station figure 19. im2 of pin 4 vs input power figure 20. im2 of pin 5 vs input power figure 21. oip2 vs frequency figure 22. oip2 vs frequency -50 -40 -30 -20 -10 0 10 -16-15-14-13-12-11-10 -9 -8 input power (dbm) dbm fundamental (1ghz and 1.1ghz) im2 (2.1ghz) -60 -50 -40 -30 -20 -10 0 10 -16 -15 -14 -13 -12 -11 -10 -9 -8 input power (dbm) dbm fundamental (1ghz and 1.1ghz) im2 (2.1ghz) 0 10 20 30 40 50 60 0500m1g 1.5g2.0g frequency (hz) dbm pin 4 pin 5 vpin 4 = +4v vpin 5 = +4v 0 10 20 30 40 50 60 70 0500m1g 1.5g2.0g frequency (hz) dbm pin 5 vpin 4 = +5v vpin 5 = +5v pin 4 typical performance (v) 50 environment, z rsc = 50 , z load port 2 = 50 , z load port 3 = 50 , measured on evaluation board. figure 23. |sds21| vs frequency figure 24. |sds12| vs frequency 10 11 12 13 14 15 16 17 18 0 500m 1g 1.5g 2.0g frequency (hz) db 27 0 -40 -38 -36 -34 -32 -30 -28 -26 0500m1g1.5g2.0g frequency (hz) db 27 0 isl55016
8 fn6526.1 june 24, 2008 applications information product description the isl55016 silicon bipolar amplifier can match a 75 single-ended source to a 100 differential load. this feature makes the isl55016 ideal for a wide range of general purpose applications, such as satellite tv. typical application circuit isl55016 is a true differential amplifier. figure 29 shows the typical application circuit of isl55016. pins 2 and 3 are equivalent. the isl55016 can configured so that it is driven with a single-ended input. if either pin 2 or pin 3 is used as a single-ended input, the other needs to be connected to an ac ground. the input is internally matched to 75 single-ended and the output is matched to 50 single-ended or 100 differential. the isl55016 can be used as differential-in and differential- out as well since pin 2 and pin 3 are equivalent, balanced inputs. balun function in many applications of is l55012, the amplifier will be followed with a balun structure to transfer the single-ended signal to a differential tuner. the isl55016 will eliminate the need for an external balun structure and provide significant savings in bom cost and pcb real-estate (see figure 30). figure 25. differential p1db vs frequency f igure 26. differential oip2 vs frequency figure 27. noise figure vs frequency figure 28. differential oip3 vs frequency typical performance (v) 50 environment, z rsc = 50 , z load port 2 = 50 , z load port 3 = 50 , measured on evaluation board. (continued) 0 2 4 6 8 10 12 14 16 18 0 500m 1g 1.5g 2.0g frequency (hz) dbm 27 0 0 10 20 30 40 50 60 70 0 500m 1g 1.5g 2.0g frequency (hz) dbm 27 0 0 2 4 6 8 10 12 0 500m 1g 1.5g 2.0g 2.5g 3.0g frequency (hz) db 20 25 30 35 500m 1g 1.5g 2.0g frequency (hz) dbm 15 10 5 0 0 27 0 1 2 3 6 5 4 rf in 1 rf in 2 isl55016 c1 c2 c5 c4 rf out 2 rf out 1 c3 l1 l2 r2 r1 +5v c6 figure 29. application circuit isl55016
9 fn6526.1 june 24, 2008 trade-off between power and oip2 the values of r 1 and r 2 (figure 29) have two options; 27 and 0 . decreasing the r 1 and r 2 value will increase the voltage across the output transistor leading to an increase in the dissipation power. at the same time, it will increase the amplitude of the compression, oip2 and oip3. figures 21, 22 and 26 show this effect on oip2. figure 25 shows the compression point changed with different resistors. figure 28 shows the oip3 changed with di fferent resistors. one needs to trade-off between the power dissipation and higher oip2. matching at the input and output in the pcb layout design, a matching network is needed, especially at the input. figure 31 shows the matching network used for the isl55016 evaluation board. 12mm 100 trace and 6mm 50 trace are used to form the input matching network and 4mm 100 trace to form the output matching network on the fr4 material. in figure 31, the s11 is impr oved at 2ghz with the matching network, to less than -10db. isl55012 isl55016 rf in differential out differential out c c c c c l l r r gnd vdd gnd c c c l c r vdd c c c c c vdd vdd l l balun rf in figure 30. comparison of isl55012 with a balun and isl55016 (relative size) 50 [ 50 [ 75 [ 100 [ 100 [ 100 [ 50 [ c1 c2 c3 l1 l2 vdd rf in rf out rf out figure 31. pcb layout of matching network isl55016
10 all intersil u.s. products are manufactured, asse mbled and tested utilizing iso9000 quality systems. intersil corporation?s quality certifications ca n be viewed at www.intersil.com/design/quality intersil products are sold by description only. intersil corpor ation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, the reader is cautioned to verify that data sheets are current before placing orders. information furnishe d by intersil is believed to be accurate and reliable. however, no responsibility is assumed by intersil or its subsidiaries for its use; nor for any infringements of paten ts or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiari es. for information regarding intersil corporation and its products, see www.intersil.com fn6526.1 june 24, 2008 thermal management the power dissipation of isl55016 is about 500mw. the recommended layout is shown in figure 31. the ground pad should be placed under the bottom of the device. at least two thermal vias are needed to lower the temperature. choices of components isl55016 is designed for wide bandwidth applications, from 50mhz to 3ghz. the decoupling and rf choke components should be chosen carefully for different frequency applications. tables 1 and 2 list the components used on the evaluation board. evaluation board setup the evaluation board is designed to connect directly to the 2-way 180 power combiner to recombine signals from -2ghz and allow single-ended assessment with good phase matching the two differential signals into one single-ended output. for lower frequencies, a different choice of power combiner is needed and short matched coaxial cables should be used to connect to the combiner. this setup is used on noise figure measurement and differential oip2/oip3 measurements. table 1. list of components (50mhz~300mhz) frequency band value description/ dimensions c1, c2 2200pf 0603 c4, c5 2200pf 0603 l1, l2 2.2h multilayer ferrite/0603 c3 1nf 0603 c6 0.1f 1206 r1, r2 27 /0 0402 figure 32. |s11| vs frequency -30 -25 -20 -15 -10 -5 0 0 0.5g 1.0g 1.5g 2.5g 3.0g frequency (hz) db 2.0g eval board with matching network probe station table 2. list of components (300mhz~3ghz) frequency band value description/ dimensions c1, c2 100pf 0603 c4, c5 100pf 0603 l1, l2 100nh surface mount/0402 c3 100pf 0603 c6 0.1f 1206 r1, r2 27 /0 0402 figure 33. evaluation board with 2-way 180 power combiner 1 2 3 6 5 4 rf in isl55016 c1 c2 c5 c4 rf out rf c3 l1 l2 r2 r1 +5v c6 1 2 s 180 power combiner differential signal output isl55016
11 fn6526.1 june 24, 2008 package outline drawing l6.1.6x1.6b 6 lead thin dual flat no-lead plastic package (tdfn) rev 1, 03/07 located within the zone indicated. the pin #1 identifier may be unless otherwise specified, tolerance : decimal ? 0.0 tiebar shown (if present) is a non-functional feature. the configuration of the pin #1 identifier is optional, but must be between 0.20mm and 0.30mm from the terminal tip. dimension b applies to the metallized terminal and is measured dimensions in ( ) for reference only. dimensioning and tolerancing conform to amsey14.5m-1994. 6. either a mold or mark feature. 3. 5. 4. 2. dimensions are in millimeters. 1. notes: bottom view detail "x" side view typical recommended land pattern top view 6x 0.24 1.12 6x 0.25 1.00 0.60 0.50bsc 0.60 1.12 0.50 0.75 pin #1 index area b 0.10 m a c c seating plane base plane 0.08 0.10 see detail "x" c c 0 . 00 min. 0 . 05 max. 0 . 2 ref c 5 1.00 ( 6 x 0 . 25 ) ( 6 x 0 . 6 ) 6 1.00 r 0.20 0.000-0.50 (4x) 0.15 index area pin 1 a 1.60 b 1.60 6 isl55016

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